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1. Jintao Zheng, Peiqi Ge*, Wenbo Bi, Yukang Zhao, Chao Wang. Effect of capillary adhesion on fracture of photovoltaic silicon wafers during diamond wire slicing. Solar Energy, 2022, 238: 105-113

2. Yukang Zhao, Peiqi Ge*, Wenbo Bi, Jintao Zheng, Jialei Lan. Machine vision online detection for abrasive protrusion height on the surface of electroplated diamond wire saw. International Journal of Advanced Manufacturing Technology, 121: 7923-7932

3. Chengyun Li, Peiqi Ge*, Wenbo Bi, Qihao Wang. Experimental investigations on optimizing manufacturing parameters for electrospark deposition diamond wire saw. International Journal of Advanced Manufacturing Technology, 2022, 121: 6523-6533

4. Jintao Zheng, Peiqi Ge*, Wenbo Bi, Yukang Zhao, Chao Wang. Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing. Solar Energy, 2022, 231: 343-354

5. Chengyun Li, Peiqi Ge*, Wenbo Bi. Thermal simulation of the continuous pulse discharge for electro-spark deposition diamond wire saw. International Journal of Advanced Manufacturing Technology, 2022, 119: 2923-2933

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