港澳宝奥66369

任仲靖
发布时间:2011-10-27 21:08:04    作者:    点击:[]
姓名 任仲靖 性别

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出生年月 1989.04
行政职务
学历 研究生 学位 博士
专业技术职务及任导师情况  助理研究员,硕士研究生导师
所在一级学科名称  机械工程
所在二级学科名称  机械电子工程

 

学术身份

山东省海外优青

 

学术兼职

Micromachines 期刊客座编辑;AAES期刊编委;APPL MATER TODAY、INTEL MAT SYST STR、SEMICOND SCI TECH等10余本SCI期刊审稿人

 

国内外学习和工作经历

2009.09-2013.07,西北工业大学,飞行器设计与工程,工学学士

2013.09-2016.03,西北工业大学,飞行器设计,工学硕士

2016.04-2020.08,斯蒂文斯理工学院,机械工程系,哲学博士(创新型人才国际合作培养项目)

2020.09-2021.08,斯蒂文斯理工学院,机械工程系,博士后

2021.10-至今,港澳宝奥66369,机械电子研究所,助理研究员

 

主讲课程

机电系统前沿技术;制造系统的感知与决策;MEMS制造技术及应用。


研究领域

1. 高面质比太阳帆设计与控制

2. 亚克级芯片卫星系统设计

3. 柔性仿生机器人

***欢迎力学、机械、控制、航空航天、材料等专业同学报考硕士研究生!

***欢迎本科生同学加入团队进行科研、科创竞赛!


承担科研项目情况

1. 山东省优秀青年科学基金项目(海外),面向下一代芯片卫星的太阳帆薄膜刚度增强与可控重构机理研究,2023.01-2025.12,主持

2. 浙江省博士后科研项目择优资助(一等),航空航天新材料锯切表面拓扑表征及其智能锯切装备工艺参数优化,2023.04-2025.04,主持

3. 山东省自然科学基金青年项目,一种兼具主动导引与取栓功能的新型脑血管介入微装置设计与调控机制研究,2024.01-2026.12,主持

4. 航空航天新材料锯切专用智能锯床结构设计与优化研究(横向),2023.07-2023.12,主持

5. 压电喷胶阀技术优化项目—机电特性优化及电控补偿设计(横向),2023.07-2024.07,主持

6. H岛主设备机器人化再制造装备机电测控系统集成与测试(横向),2021.12-2030.12,主持

 

近期主要的代表性论文、著作、专利

[1] Ren, Zhongjing, Chengyang Li, Kecai Xie, Sundeep Mangla, Chang-Yong Nam, Fernando Camino, Haipeng Wang, Jianping Yuan, and Peng Yan*. "Smart material based multilayered microbeam structures for spatial self-deployment and reconfiguration: a residual stress approach." Composite Structures 304, (2023): 116468.

[2] Tang, Tonghui, Kecai Xie, Chengyang Li, Shouyu Sun, Zhongjing Ren*, Jianping Yuan, Peng Yan. "A shape memory alloy spring driven soft crawling robot with feet of constant curvature." Journal of Intelligent Material Systems and Structures (2023).

[3] Xie, Kecai, Chengyang Li, Shouyu Sun, Chang-Yong Nam, Yong Shi, Haipeng Wang, Wu Duan, Zhongjing Ren*, Peng Yan*. Electrothermally Driven Reconfiguration of Microrobotic Beam Structures for the ChipSail System. Micromachines 14, no. 4 (2023): 831.

[4] Xie, Kecai, Chengyang Li, Shouyu Sun, Zhongjing Ren*, Sundeep Mangla, Chang-Yong Nam, Haipeng Wang, and Peng Yan*. "A helical actuator driven by biased SMA: design, model, and experiment." Acta Mechanica 234, (2023): 2659–2676.

[5] Wang, Haipeng, Zhongjing Ren, and Yingchun Guan. "Laser Joining of Continuous Carbon Fiber-Reinforced PEEK and Titanium Alloy with High Strength." Polymer 14, no. 21 (2022): 4676.

[6] Wang, Haipeng, Wu Duan, Zhongjing Ren, Xinxin Li, Wenjie Ma, Yingchun Guan, Fuqiang Liu, Li Chen, Peng Yan, and Xinguo Hou. "Engineered sandwich‐structured composite wound dressings with unidirectional drainage and anti‐adhesion supporting accelerated wound healing." Advanced Healthcare Materials (2022): 2202685.

[7] Ren, Zhongjing*, Jianping Yuan*, and Yong Shi*. " Electro-thermo-mechanical modelling of micro solar sails of chip scale spacecraft in space." Microsystem Technologies 27, no. 12 (2021): 4209 - 4215.

[8] Ren, Zhongjing*, Jianping Yuan*, Xiaoyu Su, Robert Bauer, Yang Xu, Sundeep Mangla, Chang-Yong Nam, Ming Lu, Fernando Camino, and Yong Shi*. "Current divisions and distributed Joule heating of two-dimensional grid microstructures." Microsystem Technologies 27, no. 9 (2021): 3339–3347.

[9] Ren, Zhongjing*, Jianping Yuan*, Xiaoyu Su, Yang Xu, Robert Bauer, Sundeep Mangla, Ming Lu, and Yong Shi*. "Multilayered microstructures with shape memory effects for vertical deployment." Microsystem Technologies 27, no. 9 (2021): 3325–3332.

[10] Ren, Zhongjing*, Jianping Yuan*, Xiaoyu Su, and Yong Shi*. "A novel design and thermal analysis of micro solar sails for solar sailing with chip scale spacecraft." Microsystem Technologies 27, no. 7 (2021): 2615 -2622.

[11] Ren, Zhongjing*, Jianping Yuan*, Xiaoyu Su, Sundeep Mangla, Chang-Yong Nam, Ming Lu, Fernando Camino, and Yong Shi*. "Thermo-mechanical modeling and experimental validation for multilayered metallic microstructures. " Microsystem Technologies 27, no. 7 (2021): 2579-2587.

[12] Ren, Zhongjing*, Jianping Yuan*, Xiaoyu Su, Sundeep Mangla, Chang-Yong Nam, Ming Lu, Samuel A. Tenney, and Yong Shi*. "Electro-thermal modeling and experimental validation for multilayered metallic microstructures." Microsystem Technologies 27, no. 5 (2021): 2041-2048.

[13] Ren, Zhongjing*, Jianping Yuan*, Xiaoyu Su, Hao Sun, Richard Galos, Yong Shi*, Sundeep Mangla, Ming Lu, and Fernando Camino. "Vertical deployment of multilayered metallic microstructures with high area-to-mass ratios by thermal actuation." Journal of Micro and Nano-Manufacturing 7, no. 3 (2019): 031002.

 

获奖项目

(1)航空航天工程与系统国际研讨会最佳口头报告奖,2023

(2)斯蒂文斯杰出博士奖学金,2019

(3)ASME国际会议最佳论文奖,2018

(4)国家公派出国留学奖学金,2015

(5)西北工业大学本科生毕业设计优秀论文,2013

 

联系方式

地址:山东省济南市经十路17923号港澳宝奥66369机械电子工程研究所,250061

邮箱:zren@sdu.edu.cn

 

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